Hundred Semiconductors Inc.

Hundred Semiconductors Inc.

革新

Japan Quality

Minimal Fab. Semiconductor Manufacturing Within Reach.

Hundred Semiconductors Inc.

About Us

A New Way to Develop Semiconductors

Hundred Semiconductors promotes the practical implementation of Minimal Fab, an innovative ultra-compact semiconductor manufacturing system created by the National Institute of Advanced Industrial Science and Technology (AIST) and developed with the Minimal Fab Promoting Organization and more than 100 companies. Using 12.5 mm half-inch wafers and the AIST Creative Minimal Fab (CMF), we support semiconductor development from process design to prototyping and low-volume production.

Hundred Semiconductors Inc.

Do you have any troubles like these?

✓ You want to evaluate a new semiconductor material or process, but lack the necessary in-house facilities and process expertise.
✓ Your prototype volume is too small for a conventional large-scale foundry.
✓ Your device specifications are not yet finalized, and you need support from the concept and process design stage.
✓ You want to move smoothly from prototyping to low-volume production on the same platform.

Let us handle it!

Our Strength

Built for Low-Volume, High-Mix Development

Minimal Fab offers a practical platform for semiconductor projects that do not require massive capital investment.

Its compact equipment, half-inch wafers and flexible process development enable researchers, start-ups and manufacturers to begin with smaller quantities and lower initial barriers.

Because research, development and production can use the same platform, promising ideas can move more smoothly toward engineering samples and low-volume manufacturing.

1. CUSTOM DEVICE & PROCESS DEVELOPMENT

From an Idea to a Working Device

We work with customers from the early development stage to define the required device structure and process flow. Our capabilities include CMOS, MEMS, sensors, TSV, RDL, new material evaluation and advanced packaging.
CAPABILITIES ・CMOS / SOI-CMOS
・MEMS and sensor devices
・TSV / RDL
・New material and process evaluation
・Advanced packaging development
BEST FOR ・Semiconductor and MEMS companies
・IoT and sensor manufacturers
・Universities and research institutes
・Start-ups developing new devices
・Projects requiring low-volume prototypes

2. HALF-INCH WAFERS

More Flexibility with Less Material

Our 12.5 mm half-inch wafers reduce material use and provide a practical platform for research, process evaluation, prototyping and low-volume production. —
STANDARD SPECIFICATIONS
Diameter 12.5 mm
Standard thickness 0.25 mm
Available wafers Si (100), SOI, Si (111), sapphire, quartz and glass
Si types n-type and p-type
Standard sales unit 40 wafers per shipping case
Standard lead time Approximately 2 months; selected items may be available from stock
APPLICATIONS
Material and process evaluation
Semiconductor and MEMS research
Device prototyping
Low-volume production
University and corporate R&D

3. MINIMAL FAB & EDGE ON CHIP

Small-Scale Manufacturing. Advanced Integration.

Minimal Fab uses compact, locally clean equipment and sealed wafer transport to support low-volume, high-mix semiconductor manufacturing without a conventional large-scale cleanroom. We also lead the development of Edge on Chip, an advanced packaging concept that integrates the functions required for IoT devices onto a compact substrate. EoC aims to enable smaller, lower-power and application-optimized IoT devices through the integration of sensors, processors, memory, power control and communication functions.
AREAS OF SUPPORT
Minimal Fab implementation
Low-volume semiconductor production
EoC joint research and partnerships

Promotion Video

Promotion Video Thumbnail

Service

BUSINESS ACTIVITIES

Half-inch wafer manufacturing and sales
Custom device and process development
Minimal Fab implementation and advanced packaging R&D

Main Products

MAIN PRODUCTS & TECHNOLOGIES

Half-Inch Wafers

12.5 mm wafers for research, prototyping and low-volume production.

Custom Device & Process Development

CMOS, MEMS, sensors, TSV, RDL and custom process development.

Minimal Fab & Edge on Chip

Small-scale semiconductor manufacturing and advanced packaging R&D.

Message

If you are considering semiconductor device prototyping, process development,
low-volume production, or Minimal Fab implementation, please contact us.

Our goal is to enable small-scale semiconductor manufacturing and new business opportunities.

As your R&D partner, Hundred Semiconductors works with you to make semiconductor
manufacturing more accessible and build its future through Minimal Fab.

Hundred Semiconductors Inc.

Fumito Imura, Ph.D., CEO

Contact us

Company

Hundred Semiconductors Inc.

Tsukuba Half-Inch Wafer Production Center: 5-9-5 Tokodai, Tsukuba City, Ibaraki 300-2635, Japan

Phone +81-50-3595-1250

Company Profile

Representative
Fumito Imura, Ph.D., CEO
Established
December 5, 2022
Capital
5 million yen
Revenue
Approx. 90 million yen
Employees
9 (as of July 2026)
Headquarters
810-11 Fuse, Kashiwa City, Chiba 277-0825, Japan

Corporate Website

https://i-hundred.com

MANUFACTURING & R&D NETWORK

Hundred Semiconductors Inc.

AIST Creative Minimal Fab (CMF)

Half-inch wafer production is carried out at our Tsukuba production center. For device and process development, we also utilize Minimal Fab facilities operated by partner organizations, including the Creative Minimal Fab at the National Institute of Advanced Industrial Science and Technology.

Localized clean processing and sealed wafer transport help maintain controlled wafer handling throughout the manufacturing process.

If you have any questions or concerns about our products, please feel free to contact us.

Contact us

Hundred Semiconductors Inc.

Tsukuba Half-Inch Wafer Production Center: 5-9-5 Tokodai, Tsukuba City, Ibaraki 300-2635, Japan

Phone +81-50-3595-1250